Clean Room at IFIC

R&D for silicon detectors is performed using a 80m² clean room class 10000 (ISO7) which includes 25m² class 1000 (ISO6). Clean room environment is controlled to 1^o C and 5% humidity.

Sensor Characterization

In the class 1000 room, two probe stations allow for inspection and characterization of the sensors.

Detector Bonding

The lab has two wire bonding machines : a fully automatica and programmable ultrasound bonding machine and a manual bonding machine that allows vertical access for bonds with difficult access.

Pull-tester to verify to perform the quality control to the bonds and bonding parameters.

Flip-Chip bonder for pixel bump bonding. The electrical connection is made by means of a conductive bump on the die bond pad.