Bonding Program for K5 nº 303

The program is divided in 9 differents devices and 3 differents SAW. The SAW #1 is for bonding the devices D1, D2, D3 and D7, SAW #2 is for bonding the devices D4, D5, D6 and D8 and the SAW #3 is for bonding the device D9.

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Module K5 D1 D2 D3 D4 D5 D6 D7 D8 D9

IFIC (Instituto de Fisica Corpuscular CSIC/UV)
Last Updated April 26, 2002
F. González (gonzalez@ific.uv.es)
© IFIC 2002