Both fan-ins in LINK1 has been replaced to solve the shortcircuits we had bue to bonding problems. Unfortunately in the rebonding process, the bond head went down without control. The tool crashed against one fan-in making a crater, and the clamp destroyed the master chip on link1. We don't know if it was a stop switch malfunctioning or a bug in the bonder microcode.

After cleaning the area, unbond the master chip, change the bonder tool and check the machine, we succeeded in bonding the other chips in link1.

• KaptonIII Forward Hybrid (K3-165) populated with 12 ABCD3T.
• SEQUENCER - DRAFT readout.
• Fwdlvds Support Card.

No optical readout is used, we use the electrical lines.

• Vdd = 4.00 V (on hybrid).
• Vcc = 3.50 V (on hybrid).
• Edge detection circuitry disabled.
• Compression mode Level (X1X).
• Bias Current = 220uA.
• Shaper Current = 31.2uA.
• Strobe Delay Setting:

  Input Charge(fC)	0.25	0.50	0.75	1.00	2.00	3.00	4.00
  Setting*	20.	26.	34.	36.	38.	38.	38.

  * Setting in 0 - 50 range.

Chip	M0	S1	S2	S3	S4	E5	Front
Gain(mV/fC)	44.5	46.1	47.3	50.5	50.9	--	47.9
ENC(@1fC)(e-)	2416	2112	1892	1766	1795	--	1996
ENC(@2fC)(e-)	2411	2192	1972	1829	1832	--	2047
Chip	M8	S9	S10	S11	S12	E13	Back
Gain(mV/fC)	--	50.3	52.0	49.7	46.8	48.6	49.5
ENC(@1fC)(e-)	--	1916	1703	1829	2073	2402	1985
ENC(@2fC)(e-)	--	1907	1811	1897	2260	2408	2057

Plots:

• Top plane. Gain, offset and noise(@1fC) per channel. Response curves per chip.
• Bottom plane. Gain, offset and noise(@1fC) per channel. Response curves per chip.

• Top plane. Input Noise vs Input Charge.
• Bottom plane. Input Noise vs Input Charge.